BRISTOL, PA, May 03, 2009
/24-7PressRelease/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers its 27mm CSP (chip scale package)/MicroBGA (ball grid array) test and burn-in sockets with an optional adjustable pressure pad.
With only a 0.010 inch (0.254 mm) displacement per revolution of the screw, the finest adjusting resolution of any test socket on the market, this mechanism makes the sockets ideal for testing very small, fragile devices, such as thin or ceramic chips, without causing damage, and devices with large height tolerances.
Users can back off the adjusting screw and close the socket' s lid securely with one finger and very little force, and then modify the pressure pad force with the adjusting screw after the lid is closed to ensure good contact. The screw can also be adjusted based on device height from chip to chip eliminating socket rework downtime to design a new pressure pad.
Each adjustable pressure pad comes with an easily modified, user-adjustable washer stack in 0.001 inch (0.0265 mm) and 0.010 inch (0.254 mm) increments that serves as a hard stop to eliminate device over-compression. If constant large device height changes are expected during testing, the washer stack can be removed without affecting the socket's performance.
With a signal path of only 0.077 inches (1.96 mm), the new sockets provide minimal signal loss for higher bandwidth capability. The sockets' relatively low cost and small overall size allow the maximum number of sockets per BIB (burn-in board) and BIBs per oven, while remaining operator friendly.
Aries' latest sockets use solderless pressure mount compression spring probes accurately located by two molded plastic alignment pins and mounted with stainless steel screws.
The compression spring probes leave minimal witness marks on the bottom surface of the device pads for increased reliability. Probes are constructed of heat-treated beryllium-copper with a minimum of 30 micro inches (0.75 micro mm) gold per MIL-G-45204 over a minimum of 30 micro inches (0.75 micro mm) nickel per SAE-AMS-QQ-N-290 plating.
Contact forces are 15 g per contact on a 0.30 mm to 0.35 mm pitch; 16 g per contact on a 0.40 mm to 0.45 mm pitch and 25 g per contact on pitches of 0.50 mm or larger. Operating temperature is -55°C to +150°C (-67°F to +302°F) and estimated contact life is a minimum of 500,000 cycles.
Molded socket components are Ultem. Machined socket components (if required) are PEEK or Torlon. Hardware is stainless steel.
As with all Aries sockets, the new CSP/MicroBGA test and burn-in sockets are available in custom materials, platings, sizes and configurations to suit specific customer applications.
Pricing is an additional $60 per pad for this optional feature on socket quantities of 50 or more. Delivery is four to six ARO.
For additional information, contact Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810; Tel: 215-781-9956; Fax: 215-781-9845; Email: info@arieselec.com; Web: http://www.arieselec.com, Europe Email: europe@arieselec.com. Socket data sheet # 23018 - http://www.arieselec.com/products/23018.pdf.
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READER SERVICE INQUIRIES: Please forward all reader service inquiries to Frank Folmsbee, Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810.
UPCOMING TRADESHOW: SEMICON West; Booth #7243 West Hall Level 1; July 14-16, 2009; San Francisco, CA
EDITORS NOTE: Headquartered in Bristol, Pa., Aries Electronics Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.
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