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"The AITT-DL guides a user to perform 1L, 2L and 3L measurements for high-volume manufacturing, board-quality validation, and material characterization, respectively, as required by Intel Delta-L+."
SANTA CLARA, CA, January 29, 2017 /24-7PressRelease/ -- PacketMicro announces an integrated PCB characterization solution (AITT-DL) for Intel Delta-L+ methodology. This test solution, designed to be used in a manufacturing environment, comprises a Rohde & Schwarz 4-port ZNB20 VNA, EMStar Advanced Interconnect Test Tool (AITT), and PacketMicro 20 GHz handheld D-probes.
"One of the key challenges facing PCB manufacturers is finding a cost-effective and easy-to-use solution to address PCB manufacturing qualification requirements at different stages," said Dr. Richard Zai, PacketMicro CTO. "The AITT-DL solution guides a user to perform 1L measurements for high-volume manufacturing, 2L measurements for board-quality validation, and 3L measurements for material characterization, as required by the Intel Delta-L+ methodology." In addition, the rugged handheld D-Probe has been tested and proven to provide accurate, repeatable measurements up to 20 GHz.
PacketMicro also offers a bench-top Flex Probe Station that allows engineers to reconfigure test setups for challenging board orientations quickly. Flex Probe Station supports both microprobes and rugged D-Probes. PacketMicro will demonstrate AITT-DL solution, Flex Probe Station, and rugged 20 GHz probes at DesignCon 2017, held at Santa Clara Convention Center, Santa Clara, California on February 1 and 2. Please stop by Booth #755 for product demonstration.
PacketMicro, located in Silicon Valley, offers a wide range of gigahertz probing solutions and provides world-class signal-integrity and power-integrity engineering services. In addition, PacketMicro 'Lab for Hire' services enable you to perform high-speed tests with challenging hardware configurations. PacketMicro customers include many Fortune 100 companies. For more information, please visit www.packetmicro.com.
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