/24-7PressRelease/ - MEDIA, PA, May 21, 2008 - Roberto Gilardoni, sales engineer at Hesse & Knipps, Inc., will present two papers at the joint IMAPS and SEMI Advanced Technology Workshop on Wire Bonding taking place Monday, July 14, 2008 at the Intercontinental Hotel in San Francisco the day before exhibits open at Semicon West. "Ribbon Bonding for High Frequency Applications: Advantages of Ribbon Bonding and the Impact on the Microwave Industry" will discuss the advantages of the electrical properties, mechanical and geometrical properties of ribbon bonding vs. wire bonding in the interconnection of high frequency electronics. "Process Integrated Quality Control (PiQC) for Wire Bonding" will discuss a revolutionary quality control system for wire bonding with the potential to result in 100% first pass yield.
Ribbon bonding is an important topic of interest to the microwave market as ribbon bonding continues to receive more widespread attention as an alternative to wire bonding with the increasing frequencies of electronics in all fields of information technology and the availability of fully automatic ribbon bonders that can cost effectively address the requirements of these packages. While ribbon bonding has been popular in high frequency electronics for a long time, fully automatic ribbon bonders with sufficient specification properties to justify cost of ownership haven't been available until a few years ago.
The increasing price of gold in the electronics manufacturing market is also adding momentum to the move to alternative interconnect technology that require less gold volume. Mr. Gilardoni's presentation goes into depth about how high frequency electronic packages could be produced at lower material costs but with the same electrical performance using ribbon technology. He also discusses the requirements for ribbon bonding, detailing that the differences between ribbon wedge bonders lie hidden in the bond head technology.
PIQC is a relevant topic for anyone involved in wire bonding. Mr. Gilardoni's presentation will describe this new wire bonding quality control system where, for the first time ever in the industry, all physically relevant signals are subject to evaluation in real-time, resulting in a distinct quality index. The presentation will focus on 100% first pass yield, which continues to gain importance in wire bonding for both heavy and fine wire applications, with an
increasing number of products with a 0 ppm field failure target.
For more information on the Wire Bonding Advanced Technology Workshop, please refer to the IMAPS web site at http://www.imaps.org/wirebonding.
About Hesse & Knipps
Hesse & Knipps GmbH Semiconductor Equipment, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company's automatic wedge bonders handle aluminum and gold wire in round and ribbon wire configurations with solutions for both fine and heavy wire applications ranging from 12.5 micron (.0005) to 500 microns (.020) wire diameters. The company's product line also includes ultrasonic flip chip bonders, standard or customized indexers and handling systems, and process and manufacturing monitoring systems for interfacing with the company's equipment and commercial software packages.
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