/24-7PressRelease/ - WILLOW GROVE, PA, September 14, 2005 - Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) recently received the 2005 Advanced Packaging Award (APA) in the category of Semiconductor Assembly and Test Services for its new Quatrix photolithographic package test technology.
Advanced Packaging Magazine and Semiconductor Equipment and Materials Internationa sponsor the Advanced Packaging Award (APA). A distinguished panel of industry experts chooses the best technological advancements in 19 categories, including semiconductor assembly and test services.
KandS' Quatrix is a revolutionary new interconnect technology, which offers greater electromechanical performance at lower cost-of-ownership. This new package test technology is based upon proprietary photolithographic technology developed exclusively by KandS.
Quatrix is based on an advanced photolithographic manufacturing technology that produces no sliding parts and has higher mechanical precision with improved contacts, which offers high consistency along with excellent first pass yields.
Andrei Berar, Vice President - Package Test, explains, "Our first customers have fully tested Quatrix and they see first hand the benefits of our photolithographic process with its very precise and flexible geometries. Customers have come back to us showing repeatability on the order of 3 to 4 microns."
KandS plans to further expand its Quatrix product portfolio to all of the most demanding requirements such as testing in QFN, BGA and LGA devices. For more information on Quatrix technology, visit http://www.kns.com
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