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All Press Releases for January 13, 2010 »
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New Kelvin Test Socket from Aries Ideal for Low Resistance Testing of Devices with Lead Pitch down to 0.4 mm
Aries now offers a new Kelvin test socket that handles devices with a lead pitch down to 0.4 mm. The new socket uses two independent Aries Kelvin spring probes per device pad for low resistance testing of leadless devices. 
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    BRISTOL, PA, January 13, 2010 /24-7PressRelease/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers a new Kelvin test socket that handles devices with a lead pitch down to 0.4 mm. The new socket uses two independent Aries Kelvin spring probes per device pad for highly reliable, low resistance testing of MLF, QFN, LGA and other leadless devices.

With a signal path of only 0.082" (2.08 mm), Aries' new Kelvin test socket provides minimal signal loss for higher bandwidth capability. The socket's low cost, two-piece construction and small overall size allows the maximum number of sockets per test board.

The operator-friendly, low profile socket uses solderless pressure mount compression spring probes accurately located by two molded plastic alignment pins and mounted with four stainless steel screws, allowing for easy mounting and removal from the test board.

For increased reliability, the gold-over-nickel-plated probes leave very small witness marks on the bottom surface of the device pads. The probes are constructed of heat-treated beryllium-copper with a minimum of 50 micron inches (1.27 micron mm) gold per Mil-G-45204 over 50 micron (1.27 micron mm) nickel per SAE-AMS-QQ-N-290.

The pressure pad compression spring provides proper force against the device and allows for height variations in device thickness. A probe blade edge tip ensures cutting through solder oxides layers for use in applications with RoHS-coated or gold pads.

Contact forces are 16 g per contact on a 0.40 mm to 0.45 mm pitch. The probe can operate in temperatures from -55°C to 150°C (-67°F to 302°F) and contact life is an estimated minimum of 500,000 cycles.

The machined socket components are UL 94V-0 PEEK or Torlon, screws and alignment pins are stainless steel, and molded socket components are UL 94V-0 Ultem. The Kelvin Test Socket Contact System is available for any Aries CSP Test Socket.

As with all Aries sockets, the new Kelvin test socket is available in custom materials, platings, sizes and configurations to suit specific applications.

Pricing for a Kelvin socket for typical new applications starts at $100 with lead time 4 weeks.

For additional information, contact Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810; Tel: 215-781-9956; Fax: 215-781-9845; Email: info@arieselec.com; Web: http://www.arieselec.com, Europe Email: europe@arieselec.com.Data sheet #23022 http://www.arieselec.com/Web_Data_Sheets/23022/23022.htm

For an electronic copy, please visit http://www.simongroup.com/PressRoom/WordDocs/ari/ARI-A-7394.doc

For high res photo, please visit
http://www.simongroup.com/PressRoom/Images/aries/ARI-A-7394.jpg

For additional news releases from Aries Electronics, please visit http://www.simongroup.com/PressRoom/aries.php

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READER SERVICE INQUIRIES: Please forward all reader service inquiries to Frank Folmsbee, Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810.

EDITORS NOTE: Headquartered in Bristol, Pa., Aries Electronics Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.


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