/24-7PressRelease/ - SANTA CLARA, CA, March 02, 2007 - SiGlaz, a leading provider of spatial signature analysis software to the semiconductor industry, announced the release of version 8.4 of its Intelligent Defect Analysis (IDA) software. SiGlaz IDA software provides a number of signature recognition methodologies that can be customized and optimized for a particular signature and inspection step. The latest release of the software includes an Advanced Signature Analyzer function that builds on the previous IDA object analyzer, adding new functionality to improve both accuracy and ease-of-use.
"Customers who have evaluated the IDA Advanced Signature Analyzer have found immediate applications for the new functions," said John Poreda, SiGlaz Vice President of Sales and Marketing. "The new software features, like Robust Line Function, Super Objects and Pattern Matching, significantly extend the flexibility of the object analyzer. The new step-by-step user interface, which includes a "Preview" button, makes it much easier for the user to generate the rules for the signature library."
IDA software defines an object as a group of defects that lie within a defined spatial proximity. Each object may be characterized by attributes that describe its size, shape, orientation and location. An object signature is an object whose attributes match a set of rules defined by the user. When the defect signature is characterized by a distinctive shape, it is usually well-suited for object signature analysis. A white paper describing the SiGlaz Advanced Signature Analyzer may be downloaded from the SiGlaz web site.
IDA provides several algorithms for recognizing spatial signatures, including pattern matching, zonal analysis, repeater analysis and object analysis. The Advanced Signature Analyzer may be used in conjunction with other these IDA recognition algorithms to provide very high levels of accuracy and purity.
About SiGlaz
SiGlaz is a developer of image analysis and spatial intelligence software for process monitoring and advanced process control. SiGlaz Intelligent Defect Analysis software is comprised of three modules: Defect Signature Analyzer (DSA), which allows the defect engineer to develop the methodology to analyze defect signatures in KLA results files; Automation Workbench (AWB), which enables the engineer to generate an analysis recipe and to automatically monitor and analyze results files in production; and Intelligent Reporting System, which allows the user to analyze long term defect signature trends and to generate customized reports.
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Press Release Keywords:- analysis, control, defect, inspection, management, process, semiconductor, signature, software, spatial, yield
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