An expert in electronic package design and development, he works with various business units as they define new products.
PHOENIX, AZ, April 26, 2023 /24-7PressRelease/ -- Eric T. Gelvin has been included in Marquis Who's Who. As in all Marquis Who's Who biographical volumes, individuals profiled are selected on the basis of current reference value. Factors such as position, noteworthy accomplishments, visibility, and prominence in a field are all taken into account during the selection process.
Contributing more than 25 years of professional excellence to his career, Mr. Gelvin is a package development engineer and a member of the technical staff for package development at ON Semiconductor. An expert in electronic package design and development, he works with various business units as they define new products. He also designs and develops packages and works with internal and external assembly sites to guarantee that all products meet necessary manufacturability and reliability requirements. Noting the significance of Mr. Gelvin's role, package engineering is an interdisciplinary field that combines science, engineering, technology, and management to protect and categorize products for distribution, storage, sale, and use. It also plays a critical role in today's environment.
Based in Phoenix, ON Semiconductortor is a leading semiconductor manufacturer that focuses on building a better future through intelligent technology. Established over six decades ago, the company has design centers, manufacturing sites, and solution engineering centers in more than 70 countries worldwide.
Mr. Gelvin began his career with Intel Corporation in 1995, working in package design, quality, reliability, process development, procurement, and various phases of electronic packaging. After over a decade with the organization, he was recruited by Freescale Semiconductor as a senior packaging engineer in 2007. Mr. Gelvin subsequently earned the roles of a cost model and value engineering manager at NXP Semiconductors from 2014 to 2017 and as a technical program manager at UGS America Sales inc. between 2017 and 2020.
Mr. Gelvin has published several scholarly journal articles and professional handbooks as a seasoned researcher. He also secured a U.S. patent in his field in 2002. Mr. Gelvin attributes his success to the support of his family and several mentors.
Active civically, Mr. Gelvin frequently donates and serves as a volunteer coach for the Leukemia & Lymphoma Society's Team in Training program.
An alumnus of Arizona State University, Mr. Gelvin earned a Bachelor of Science in mechanical engineering in 1994 and a master's degree in statistics in 2002. He also received credentials as a lean six sigma green belt through the Management and Strategy Institute in 2019. To remain aware of developments in his field, Mr. Gelvin is a member of the Institute of Electrical and Electronics Engineers.
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